High purity silica powder is the main raw material for epoxy molding sealing material. Due to SiO2 has stable physical and chemical properties, good light transmittance, linear expansion performance and excellent high temperature performance, it is one of ideal filling material of epoxy sealing material and also one of ideal substrate material of semiconductor integrated circuit.
Product features:

1, large specific surface area: no pore surface, low moisture content;
2, good dispersion: no surface adhesion force, smooth ball, easy to disperse;
3, high purity: high purity raw materials and special processing, low content of impurity ions;
4, the particle size distribution is narrow and controllable: easy to grade mixing processing;